Abstract

This study focuses on the integration of precise thermal regulation within optical systems, acknowledging that temperature stability is paramount to their optimal performance. Minor temperature deviations can precipitate considerable operational inefficiencies in such systems. The core of this research involves the development of a Printed Circuit Board (PCB) that incorporates a Thermoelectric Cooler (TEC) module, aiming to achieve meticulous temperature control. The methodology encompasses a comprehensive process of designing, soldering, and rigorous testing. The outcome is a sophisticated system capable of maintaining a consistent thermal environment for optical components with remarkable precision. This paper delineates the methodology employed in amalgamating thermal management with PCB design and discusses the significant implications of these advancements in practical applications.

Document Type

Article

Author's School

McKelvey School of Engineering

Author's Department

Electrical and Systems Engineering

Class Name

Electrical and Systems Engineering Undergraduate Research

Date of Submission

1-10-2024

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